Products Description
Product Highlights
Designed for high-end products such as sapphire and silicon wafers, ensuring ultra-flatness and high productivity
Independent frequency-controlled spindle and grinding heads with soft start/stop for precision and protection
Four stations can run independently or together, with single-station pressure up to 220KG for flexible efficiency
Full stainless-steel structure with automatic slurry mixing and dispensing for durability and cost savings
Proprietary touch-screen digital control and Japanese pneumatic components for intelligent and reliable performance
| ZD630B-C单面研磨抛光机主要参数 | |||
Grinding Plate Size (mm) | Φ800 | PlateRotation Speed （r.p.m） | 0~50 |
Stations | 4 Stations | Driving Speed（r.p.m） | 0~50 |
Maximum Workpiece Diameter （mm） | Ф300 | WorkingAir Pressure （Mpa） | 0.4~0.5 |
Machine Weight | 1500KG | PowerSupply Voltage | Three-phase Five-wire 380V |
Overall Dimensions （W*D*H）mm | 1400*1400*2200 | Total Power | 6KW |
